Overview

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‍Research Internships at Microsoft provide a dynamic environment for research careers with a network of world-class research labs led by globally-recognized scientists and engineers, who pursue innovation in a range of scientific and technical disciplines to help solve complex challenges in diverse fields, including computing, healthcare, economics, and the environment.

This Research Internship is hosted in Thermo-Mechanical Engineering team within Strategic Planning and Architecture (SPARC), a group dedicated to architecting and planning the world’s most advanced cloud infrastructure by driving the hardware systems vision and architectural roadmap for the Microsoft Cloud. SPARC unites technologies from across Azure and beyond to deliver platforms that empower innovation across devices, servers, and data centers. Our mission is to design platforms for the future, foster first-rate engineering practices, and simplify the development of breakthrough technologies and solutions.

As a Research Intern, you will gain hands-on experience in designing, simulating, validating, and optimizing cooling technologies for next-generation compute and Artificial Intelligence (AI) workloads. You’ll contribute to projects that advance cold plate and retention mechanism design, thermal interface material qualification, and simulation-driven optimization using industry-leading tools. Your work will directly support SPARC’s mission to enable scalable, energy-efficient, and cost-effective infrastructure for AI and cloud services, helping Microsoft maintain its leadership in high-performance computing.

Beyond technical contributions, you’ll be immersed in a collaborative culture that values curiosity, rigorous process, and data-driven decision-making. SPARC emphasizes community, learning, and empowerment, ensuring that every team member has opportunities to grow and make an impact. You’ll prepare technical reports, present findings to cross-functional teams, and engage with mentors who are passionate about shaping the future of cloud infrastructure and AI platforms.

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‍Responsibilities‍

Research Interns put inquiry and theory into practice. Alongside fellow doctoral candidates and some of the world’s best researchers, Research Interns learn, collaborate, and network for life. Research Interns not only advance their own careers, but they also contribute to exciting research and development strides. During the 12-week internship, Research Interns are paired with mentors and expected to collaborate with other Research Interns and researchers, present findings, and contribute to the vibrant life of the community. Research internships are available in all areas of research, and are offered year-round, though they typically begin in the summer.

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Additional Responsibilities

• Contribute to cold plate and retention mechanism design for different cooling technologies.
• Assist with thermal interface material (TIM) qualification, including reliability and performance testing.
• Support simulation and optimization projects using tools such as Ansys Mechanical, Ansys Icepak, Ansys Fluent, Siemens Flotherm , PTC CREO and Solidworks.
• Participate in functional thermal testing using both thermal test vehicles (TTVs) as well as functional AI and general compute platforms; document performance, analyze data and propose corrective actions using different tools such as MATLAB, Python, JMP.
• Prepare technical reports and present findings to cross-functional teams as required.

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‍Qualifications‍

Required Qualifications

• Currently enrolled in a MSc or PhD degree in Mechanical Engineering, Thermal Engineering, Mechatronics Engineering, or related STEM fields.

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Other Requirements

• Research Interns are expected to be physically located in their manager’s Microsoft worksite location for the duration of their internship.
• In addition to the qualifications below, you’ll need to submit a minimum of two reference letters for this position as well as a cover letter and any relevant work or research samples. After you submit your application, a request for letters may be sent to your list of references on your behalf. Note that reference letters cannot be requested until after you have submitted your application, and furthermore, that they might not be automatically requested for all candidates. You may wish to alert your letter writers in advance, so they will be ready to submit your letter.

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Preferred Qualifications

• Possess proficient theoretical knowledge of heat transfer principles and materials science.
• Experience with CAD tools and metrology (complex assemblies, tolerance analysis, first-order inspections).
• Experience with thermal and structural analysis software (conjugated heat transfer, dynamic stress and deformation, DOE).
• Exhibit a strong analytical and problem-solving skills with attention to detail.
• Possess a hands-on approach to evaluating new designs, and it is comfortable with running experiments with new products and prototypes.
• Ability to work collaboratively in a fast-paced environment.
• Possess familiarity with coding and programming simple scripts for automation and data processing.
• Capability to interpret wiring diagrams and is familiar with installing and acquiring data from different types of sensors.

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