请注意，申请此实习岗位需要满足如下条件：
毕业时间：26年12月至27年9月之间毕业
面试时间：26年2月开始
入职日期：26年6月
实习时间：暑期全职实习，至少持续3个月
工作地点：深圳市福田区，深圳国际创新中心B座
简历要求：请提供中英双语简历（放在一个文件中）
投递须知：
1 填写简历申请时，请把必填和非必填项都填写完整。提交简历之后就无法修改了哦！
2 学校的英文全称请准确填写。
3 校招信息请参考校园招聘申请手册：https://amazonexteu.qualtrics.com/CP/File.php?F=F_55YI0e7rNdeoB6e
Amazon Lab126 is an inventive research and development company that designs and engineers high-profile consumer electronics products such as the Kindle, Kindle Fire, Fire TV, Echo and Ring devices. We're seeking a Hardware Development Engineer (HDE) Intern to join our innovative team working on hybrid software-hardware systems for AI deployment on device.
This internship focuses on optimizing hybrid software-hardware systems for on-device AI applications, with emphasis on both hardware design and software implementation. The HDE Intern works closely with teams located in the US and China throughout the development cycle. As a member of the team, you will assist in driving cross-functional communication within the region, collaborating with both Hardware Engineering and Software Development teams.
• Work closely with Hardware Engineering teams and Software Development teams to optimize AI deployment on device
• Assist in hardware-software co-optimization for consumer electronics applications, including architecture design and system integration
• Participate in electronic and electrical design, troubleshooting, and component testing for AI hardware accelerators
• Implement and optimize software algorithms for AI/ML model deployment on embedded systems
• Explore optimization methods including pruning, quantization, architecture optimization, and hardware-software co-optimization
• Support hardware design readiness for engineering builds and participate in hardware development reviews
• Assist in the organization of technical documentation throughout the development cycle
• Work closely with suppliers and manufacturing teams as needed
• Travel domestically and internationally to supplier sites as needed to keep projects on schedule
- Speak, write, and read fluently in Mandarin
- Speak, write, and read fluently in English
- Currently enrolled in Master's degree program in Electrical Engineering, Electronic Engineering, Computer Engineering, or related STEM field
- Must be in pre-final year of Master's program (graduating between Nov 2026 to Sept 2027)
- Demonstrated experience with programming languages such as C/C++ and Python
- Knowledge and experience with AI/ML technologies and frameworks
- Understanding of hardware systems for AI deployment, including embedded systems design and hardware accelerators
- Can work 5 days per week during summer holiday for at least 3 months duration in Shenzhen
- Willing to work in Shenzhen and collaborate with international teams
- Knowledge of electronic design in consumer electronics
- Experience with AI/ML system deployment and model optimization techniques (pruning, quantization, etc.)
- Experience with FPGA development and embedded programming
- Understanding of Digital Signal Processing fundamentals
- Experience with hardware-software co-design methodologies
- Knowledge of on-device AI inference optimization
- Familiarity with AI hardware accelerators and custom silicon (e.g., edge AI processors)
- Experience with real-time system constraints and power optimization
- Excellent oral and written communication skills (Chinese and English)
- Strong organizational and problem solving skills
- Demonstrated critical thinking capability
- Self-motivated and proactive
- Previous technical internship experience
- Past experience or coursework in electronic design and AI/ML implementation
