Job Description
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βResponsibilitiesβ
We focus on process development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.
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Responsibilities may include:
- Develop and maintain wafer fabrication processes
- Develop and maintain package assembly processes
- Specify, select and qualify new equipment
- Contribute to process automation
- Review new designs for manufacturability and provide feedback to module designers
- Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
- Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
- Meet accelerated project schedules; communicate and manage risks
- Develop and maintain high yields while adhering to project schedules
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We are seeking an industry professional with proven expertise in one or more of the following areas:
- Design for manufacturing of electromechanical assemblies
- Statistical process control (SPC), design of experiments (DOE)
- Thermocompression / flip chip bonding
- Surface Mount Technology (SMT) processes
- Die singulation
- Semiconductor fabrication processes
- Heterogeneous integration, advanced packaging techniques
- New technology introduction
- New product introduction
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This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in 6G markets. Excellent interpersonal and communication skills are important for successful cross-functional interactions.
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βQualificationsβ
BS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.
Professional experience in the following areas is desired:
- III-V compound semiconductors and/or silicon technologies
- Thermal, mechanical and electrical reliability
- Technical project management, project lifecycle
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