Job Description
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
MTS SILICON DESIGN ENGINEER
THE ROLE:
This position requires a deep understanding of device physics, components design and silicon manufacturing processes. Proficiency in circuit simulation, layout review, data analysis, and SPICE/EM modeling is essential. FPGA design experience is preferred. Strong collaboration and communication skills are critical, as the position involves working closely with cross-functional teams.
THE PERSON:
A successful candidate will demonstrate expertise in baseband and RF components design and modeling in advanced technology nodes. As a silicon design engineer, the candidate will be highly accurate and detail-oriented, able to work independently, take full ownership of project deliverables, and effectively solve complex technical challenges.
KEY RESPONSIBLITIES:
- Perform device characterization, SPICE modeling and simulation support to FPGA product design
- Responsible for design, optimize, and validate baseband and RF components in advanced CMOS nodes
- Perform schematic design and simulations using Cadence Virtuoso, Spectre, and HSPICE
- Guide and review layout implementation to ensure optimal device performance and manufacturability
- Analyze silicon measurement data and correlate with simulation models to enhance design accuracy
- Conduct SPICE and EM modeling using tools such as ICCAP, HFSS or EMX
- Explore and evaluate stacked-die and 3DIC technologies, including simulation, modeling and layout consideration for heterogeneous integration
- Collaborate with foundry and internal teams to utilize and validate PDKs, perform parasitic extraction, and ensure physical verification compliance
PREFERRED EXPERIENCE:
- Working experience in baseband and RF component design and modeling
- Proficiency in industry-standard EDA tools including Cadence Virtuoso, Spectre, and HSPICE
- Strong background in SPICE modeling and QA for semiconductor devices
- Familiar with foundry PDKs, parasitic extraction, and physical verification flows
- Experience with EM simulation and modeling tools such as HFSS, EMX and ICCAP
- Working knowledge of FinFET and GAA technologies at 3nm, 2nm, and beyond
- Experience with simulation and modeling in 3DIC and stacked technology is a plus
- Knowledge with experience in FPGA design is a strong plus
ACADEMIC CREDENTIALS:
- Bachelors degree in engineering or physical science, preferably with advanced degree (MS or PhD)
