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πŸ“
Santa Rosa, CA

R&D IC Design Intern

Internship
Technology
Engineering
November 12, 2025

Keysight Technologies

Test-and-measurement electronics & software
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Overview

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‍‍Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

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‍Responsibilities

This job will be part of the Keysight Labs Organization, which enables Keysight be first to market, focusing on top opportunities and market trends that address unmet needs. As a MMIC Design Intern, you will be joining a dedicated team of visionaries to innovate and deliver the next generation of high frequency, state of the art components that enable breakthrough performance in Keysight's instruments. Keysight fosters a collaborative engineering environment which emphasizes teamwork, enthusiasm, and excellence in creating high performance solutions.

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‍Qualifications‍

Education:

Pursuing M.S., or Ph.D. in Electrical Engineering or closely related field, with thesis work and/or relevant industry experience in mm-wave IC design.Experience:β€’ mm-wave IC design in advanced semiconductor technologies.β€’ Experience in using the following tools or equivalent: ADS, Momentum, RFPro, EMPro.β€’ Demonstrated ability to work well in a team environment, document, and present results.A successful person in this job will have:β€’ An understanding of semiconductor devices and high frequency circiut design to develop creative design methodologies to push process limitations.

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β€’ Experience in on-wafer probe calibration and measurements.

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β€’ Knowledge in device modelling, thermal design, and IC package design.β€’ An understanding of current state of the art technologies and what might be possible with a combination of circuit design and process capabilities, helping to drive key specifications.β€’ Excellent interpersonal, problem solving, time management and communication skills to work in dynamic environment as part of multiple teams working on multiple projects.

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β€’ Be highly motivated to accomplish all the tasks required to meet aggressive product development schedules and world class manufacturing expectations.

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Candidates who wish to be considered must be enrolled in a accredited college/university as of September 2026. Applicants who have graduated before September 2026 will not be considered unless they are entering/applying to a MS or PHD program after graduating.

Visa Sponsorship is not available for this position. Candidates who now or at any point in the future require sponsorship for employment visa status (e.g., H-1B Visa status) may not be considered.

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