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πŸ“
Boise, ID

Area Manufacturing Engineer - Dry Etch

3 yrs
Technology
Engineering
October 30, 2025

Micron Technology

Semiconductor and memory chip manufacturer
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At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and supply to the growth and innovation of the semiconductor industry.

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F4 HVM ME Area Manufacturing Engineers are responsible for mitigating area capacity risks and providing an operational corridor that enables development pace to meet program timelines and work within their assigned process areas. This is accomplished by identifying and handling the systemic issues that enable the area-level tactical execution of the business plan (cycle time, process duplication, q-time setup, area holds). This role must reduce operational risk by deploying capital through detailed risk assessments and collaborating with colleagues in Process Development, Process and Equipment Engineering, Advanced Technology Engineering, and Industrial Engineering counterparts.


This role works closely with the Technology Development and HVM Industrial Engineering team to jointly evaluate future tool needs, to understand area tool limiters, and capacity scenarios. Additionally, the area engineer will team with the Manufacturing Engineering section heads to jointly evaluate and address the priorities of the area and drive consistent manufacturing procedures that meet engineering and quality requirements. Additional duties include but are not limited to:

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Responsibilities

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Minimum Qualifications

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Preferred Qualifications

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