The intern will have an exciting opportunity to develop ICP etch wafer process for recording head fabrication in a wafer process development team at our R&D site in Bloomington, MN.
About the role - you will:
- You will participate in ICP (inductive coupled plasma) etch process development in a development environment, under the supervision of one or more engineers. Projects may include developing ICP processes, collecting/analyzing data and presenting the results to the engineering community.
- You will acquire hands-on key skills to ICP process development that are applicable to both hard drive and semiconductor industries.
- Working in a team environment, you will be exposed to senior engineers and will have the opportunity to share your knowledge and learn from them.
About you:
- Good written and verbal communication abilities.
- Highly productive in both team and independent work environments.
- Must be detail-oriented
Your experience includes:
- GPA 3.0 or better
- Cleanroom experience a plus but not must
- BS, MS, PhD student pursuing a degree in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, Physics or related science and engineering disciplines.
You might also have:
- Some understanding of plasma etch is preferred.
