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Singapore

Temasek Undergraduate Overseas Scholarship

Graduate Program
Financial Services
Finance
September 19, 2025

Temasek

Singaporean-based global investment company
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Introduction

The Temasek Undergraduate Overseas Scholarship is a programme awarded to exceptional polytechnic graduates who demonstrate academic excellence, outstanding extracurricular involvement, and a strong passion for the science, technology, engineering, and mathematics (STEM) fields.  

With the opportunity to pursue further education at one of the top overseas universities, the Scholars are required to express desire to making meaningful contributions to Singapore’s innovation and growth upon graduation.

Scholarship Benefits

Eligibility Criteria

Interested polytechnic students are welcome to apply prior to commencing their undergraduate degree. You may apply prior to receiving your final Cumulative GPA and examination results.

Applicants must:

A provisional scholarship offer may be extended if an applicant is found suitable. This will be subject to confirmation upon the release of his/her final cumulative GPA, examination results, and acceptance into an overseas university.  

Bond Period

Upon graduation, the scholar is required to contribute to Singapore’s innovation and growth and serve a 4-year bond to work in Singapore or with a Singapore-headquartered company, in a STEM-related role.  

Application Details

Deadline for Submission: 28 September 2025

Applications will be assessed on a rolling basis until September 2025. Only shortlisted applicants will be notified.

Before starting your application, you are encouraged to gather the following supporting documents in a single file for ease of uploading (under CV submission).

Kindly note the following: