We are seeking a highly skilled and experienced Engineer to take ownership of reliability functions in package development projects, ensuring robust performance and successful product qualification.
Job Description
In your new role you will:
- Owner of Reliability Functions for package development projects with high competency in five core relevant Fields of Knowledge.
- First Level Reliability – Good comprehension of first-level reliability test objectives, requirements, and parameters, with proficiency in international specifications (JEDEC, AEC, IPC).
- Package Integrity Tests – Proficient in implementing major reliability tests according to project scope and requirements, based on project Delta Analysis, FMEA, etc.
- Internal Package Analysis – Basic understanding of FA analysis tools and methods, with the ability to implement them on completed reliability stress test samples. Capable of deriving comprehensive reports and providing RQ expertise in proposals and recommendations.
- Chip/Package/Board Co-Design – Proficient in CPiB and its implementation for robust packaging reliability execution and qualification, leading to successful product release.
Your Profile
You are best equipped for this task if you have:
- Master’s / Bachelor’s Degree in Engineering (Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology) or Science (Chemistry, Physics, Materials).
- Minimum of 1-2 year of working experience in reliability engineering within the semiconductor industry. Graduates are encouraged to apply.
- Excellent analytical and problem-solving skills, with the ability to derive actionable insights from data.
- Strong communication and collaboration skills, able to work effectively with cross-functional teams.
- Fluent in English with proficiency in technical writing and reporting.
- Hands-on experience in data analysis, statistical methods and database handling.
