The Wet Process Engineering team is responsible for controlling and optimizing Chemical Mechanical Polish (CMP), Electroplating, Wet Chemical Etch, Cleans, and Wafer Backgrind operations used to fabricate Magnetic Recording Heads in our Bloomington, MN facility. In this internship you will take ownership of process engineering development or optimization projects with the support of an engineering mentor to contribute to manufacturing the latest generation of recording heads that go into Seagate’s most advanced Hard Disc Drives (HDDs)
About the role - you will:
- Develop technical understanding of one or more wet chemical process tools used in the thin film head wafer manufacturing process
- Work closely with experienced process engineers to design and perform experiments to improve or optimize wafer manufacturing processes
- Operate wafer processing tools in a cleanroom environment
- Develop wafer process equipment qualification methods
- Quantify process results using various wafer measurement techniques such as ellipsometry, atomic force microscopy, profilometry, time-resolved acoustic thin film metrology, x-ray fluorescence, or white light interferometry
- Use software tools as needed to perform statistical data analysis and document and present your work
About you:
- Interest in nano-fabrication processes and operations
- You are self-motivated, able to work independently, and have excellent attention to detail.
- You are capable of working in partnership with and communicating effectively with a diverse group of engineers and technicians
- You are able to maintain thorough documentation of results and be able to clearly discuss them with other staff members in engineering forums
Your experience includes:
- Statistical data analysis experience using R, Excel, JMP, MatLab, or Python
- BS student pursuing a degree in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, Physics, or related disciplines enrolled in Fall 2026 classes
