1. Responsible for the repair and maintenance of equipment in the semiconductor product line.
2. Manage and improve machine tool parts systems, including spare parts management from manufacturers and subcontractors.
3. Improve machine design, maintenance fixtures, and processes to enhance machine stability.
4. Internship Completion Standard: Completion of new employee training and shift assessment.
5. There is an opportunity to become a full-time employee after the internship.
1. The Module Assistant Engineer Internship Program is specifically designed for university students, targeting fourth-year students. The internship period is from July 2026 to June 2027.
2. Departments: Mechanical Engineering, Motor Engineering, Electrical Engineering, Electronics, Optoelectronics, Mechatronics, Mold Design, Automation, Aeronautics, Vehicle Engineering, Electrical Auxiliary Systems, Mechanical Design, Semiconductor Engineering, Optoelectronic Semiconductors, Advanced Application Materials, Intelligent Robotics Engineering, Chemical Engineering and Materials Science, Electrical Engineering, Computer Science, and other related STEM fields are preferred.
3. Possesses problem-solving, communication, teamwork, and proactive learning abilities.
4. Able to work in a cleanroom environment while wearing cleanroom suits for most of the workday.
5. Basic English reading and writing skills
