Job Responsibilities

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1. Responsible for the repair and maintenance of equipment in the semiconductor product line.

2. Manage and improve machine tool parts systems, including spare parts management from manufacturers and subcontractors.

3. Improve machine design, maintenance fixtures, and processes to enhance machine stability.

4. Internship Completion Standard: Completion of new employee training and shift assessment.

5. There is an opportunity to become a full-time employee after the internship.

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Job Qualifications

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1. The Module Assistant Engineer Internship Program is specifically designed for university students, targeting fourth-year students. The internship period is from July 2026 to June 2027.

2. Departments: Mechanical Engineering, Motor Engineering, Electrical Engineering, Electronics, Optoelectronics, Mechatronics, Mold Design, Automation, Aeronautics, Vehicle Engineering, Electrical Auxiliary Systems, Mechanical Design, Semiconductor Engineering, Optoelectronic Semiconductors, Advanced Application Materials, Intelligent Robotics Engineering, Chemical Engineering and Materials Science, Electrical Engineering, Computer Science, and other related STEM fields are preferred.

3. Possesses problem-solving, communication, teamwork, and proactive learning abilities.

4. Able to work in a cleanroom environment while wearing cleanroom suits for most of the workday.

5. Basic English reading and writing skills

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About the company

TSMC

Company overview

TSMC is the world’s largest pure-play semiconductor foundry, manufacturing chips for companies that design their own silicon but do not run fabs. TSMC produces advanced and specialty process technologies used in smartphones, high-performance computing, automotive, and industrial electronics. TSMC also operates packaging and related services that help customers move from wafer to finished components. Growth outside Taiwan has become more visible through major capacity builds in the United States, Japan, and Europe.

Locations and presence

TSMC is headquartered in Taiwan and runs large manufacturing and R&D sites there, alongside overseas manufacturing in places such as Arizona (US) and Kumamoto (Japan), with additional subsidiaries and support offices in multiple regions. Most early-career roles tied to fabs, equipment, and manufacturing engineering are on-site due to cleanroom and shift requirements, with fewer flexible roles in corporate and some software functions.

Palpable Score

/ 100

TSMC offers real early-career access through large-scale hiring, expanding internships in Arizona, and a paid technician apprenticeship route, plus visible training infrastructure for new joiners. Hiring steps are described publicly, but candidate experience signals are mixed and the company is facing public legal allegations in the US that raise fairness and culture questions. The strongest outcome evidence is retention data published by the company, but progression metrics like promotion timelines and conversion rates are not shared in a consistent way.

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